Method and structure for semiconductor mid-end-of-year (MEOL) process

ABSTRACT

A semiconductor device includes a first conductive structure directly over an isolation structure; a second conductive structure directly over an active region; a first dielectric layer over the first and second conductive structures; a second dielectric layer over the first dielectric layer, wherein the first and second dielectric layers include different materials; a first conductive feature contacting the first conductive structure through at least the first and second dielectric layers; and a second conductive feature contacting the second conductive structure through at least the first and second dielectric layers, wherein the first and second conductive features include a same metal.

PRIORITY

This is a continuation of U.S. application Ser. No. 15/952,316, filedApr. 13, 2018, which is a continuation of U.S. application Ser. No.15/493,847, filed Apr. 21, 2017 and issued U.S. Pat. No. 9,947,646,which is a divisional of U.S. application Ser. No. 14/942,678, filedNov. 16, 2015 and issued U.S. Pat. No. 9,633,999, herein incorporated byreference in its entirety.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experiencedexponential growth. Technological advances in IC materials and designhave produced generations of ICs where each generation has smaller andmore complex circuits than the previous generation. In the course of ICevolution, functional density (i.e., the number of interconnecteddevices per chip area) has generally increased while geometry size(i.e., the smallest component (or line) that can be created using afabrication process) has decreased. This scaling down process generallyprovides benefits by increasing production efficiency and loweringassociated costs. Such scaling down has also increased the complexity ofprocessing and manufacturing ICs and, for these advancements to berealized, similar developments in IC processing and manufacturing areneeded.

For example, in the mid-end-of-line (MEOL) processes, it is typical thatgate via holes are etched in some areas that have dense vias and in someareas that have isolated vias. It is difficult to control via etchingdepth in both the dense and isolated via areas when the vias arepartially etched. As a result, the via depth varies from one area toanother. The via depth variation may cause issues in subsequentfabrication. For example, it may cause a leakage concern when gatecontacts and source/drain (S/D) contacts are formed in a later step.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isemphasized that, in accordance with the standard practice in theindustry, various features are not drawn to scale. In fact, thedimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIGS. 1A and 1B are a flow chart of a method of forming a semiconductordevice according to various aspects of the present disclosure.

FIGS. 2A, 2B, 2C, 2D, 2E, 2F, 2G, 2H, 2I, 2J, 2K, and 2L arecross-sectional views of a portion of a semiconductor device constructedaccording to the method in FIGS. 1A and 1B, in accordance with anembodiment.

FIG. 3 illustrates areas of an IC that have different gate pitches.

FIG. 4 illustrates areas of an IC that have different via pitches.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

The present disclosure is generally related to semiconductor devices andmethods of forming the same. More particularly, the present disclosureis related to MEOL processes in semiconductor manufacturing. One objectof the present disclosure is to provide methods and structures forimproving the MEOL processes in view of via depth loading issuesassociated with unevenly distributed vias in different areas of an IC.

FIGS. 1A and 1B show a flow chart of a method 10 of forming asemiconductor device 100, according to various aspects of the presentdisclosure. The method 10 is merely an example, and is not intended tolimit the present disclosure beyond what is explicitly recited in theclaims. Additional operations can be provided before, during, and afterthe method 10, and some operations described can be replaced,eliminated, or moved around for additional embodiments of the method.The method 10 is described below in conjunction with FIGS. 2A-2L whichare cross-sectional views of the semiconductor device 100 in variousstages of a manufacturing process.

The semiconductor device 100 is provided for illustration purposes anddoes not necessarily limit the embodiments of the present disclosure toany number of devices, any number of regions, or any configuration ofstructures or regions. Furthermore, the semiconductor device 100 asshown in FIGS. 2A-2L may be an intermediate device fabricated duringprocessing of an IC, or a portion thereof, that may comprise staticrandom access memory (SRAM) and/or logic circuits, passive componentssuch as resistors, capacitors, and inductors, and active components suchas p-type field effect transistors (PFETs), n-type FETs (NFETs),multi-gate FETs such as FinFETs, metal-oxide semiconductor field effecttransistors (MOSFETs), complementary metal-oxide semiconductor (CMOS)transistors, bipolar transistors, high voltage transistors, highfrequency transistors, other memory cells, and combinations thereof.

At operation 12, the method 10 (FIG. 1A) provides a precursor of thedevice 100 as shown in FIG. 2A. For the convenience of discussion, theprecursor of the device 100 is also referred to as the device 100.Referring to FIG. 2A, the device 100 includes a substrate 102 andvarious features formed therein or thereon. The substrate 102 includestwo substrate regions 102A and 102B. In the present embodiment, thesubstrate region 102A includes an insulator such as a shallow trenchisolation (STI), while the substrate region 102B includes active regionsfor forming transistors. In the present embodiment, the two substrateregions 102A and 102B serve for different purposes for the device 100.For example, the substrate region 102A may be used for forming powerrails such as voltage supply and/or ground plane, while the substrateregion 102B may be used for forming logic circuits. As shown in FIG. 1A,the substrate region 102B includes various source and drain (S/D)regions 104 and channel regions 106 between the S/D regions 104.

Still referring to FIG. 1A, the device 100 further includes a pluralityof gate stacks 108A, 108B, 108C, 108D, 108E, 108F, and 108G, wherein thegate stacks 108A-C are disposed over the substrate region 102A, and thegate stacks 108D-G are disposed adjacent to the channel regions 106 inthe substrate region 102B. The device 100 further includes a dielectriclayer 110 disposed over each gate stack 108A-G, and a gate spacer 112 onsidewalls of each gate stack 108A-G and on sidewalls of the respectivedielectric layer 110. In the present embodiment, the device 100 includesa contact etch stop (CES) layer 114 over the substrate 102 and onsidewalls of the gate spacer 112, and further includes an inter-layerdielectric (ILD) layer 116 over the CES layer 114. The device 100further includes contacts 118A and 118B over the substrate regions 102Aand 102B respectively. Over the substrate region 102A, the contacts 118Aare disposed over the CES layer 114 between some of the gate stacks(e.g., between the gate stacks 108A and 108B). In the presentembodiment, the contacts 118A are used for forming power rails.Therefore, they are also referred to as power contacts 118A. Over thesubstrate region 102B, the contacts 118B are disposed over the S/Dregions 104 and in electrical communication with the respective S/Dregions 104. Therefore, they are also referred to as S/D contacts 118B.The device 100 further includes a dielectric layer 120 over the contacts118A-B. The various features (or components) of the device 100 arefurther described below.

The substrate 102 is a silicon substrate in the present embodiment. Inalternative embodiments, the substrate 102 includes other elementarysemiconductors such as germanium; a compound semiconductor such assilicon carbide, gallium arsenide, indium arsenide, and indiumphosphide; or an alloy semiconductor, such as silicon germanium carbide,gallium arsenic phosphide, and gallium indium phosphide. In embodiments,the substrate 102 may include silicon on insulator (SOI) substrate, bestrained and/or stressed for performance enhancement, include epitaxialregions, include isolation regions, include doped regions, and/orinclude other suitable features and layers.

The substrate region 102A includes an insulator (or an isolationstructure), and may be formed of silicon oxide, silicon nitride, siliconoxynitride, fluoride-doped silicate glass (FSG), a low-k dielectricmaterial, and/or other suitable insulating material. The insulator maybe STI features. In an embodiment, the insulator is formed by etchingtrenches in the substrate 102, filling the trenches with an insulatingmaterial, and performing a chemical mechanical planarization (CMP)process to the substrate 102 including the insulating material. Thesubstrate region 102A may include other isolation structure(s) such asfield oxide and LOCal Oxidation of Silicon (LOCOS). The substrate region102A may include a multi-layer isolation structure.

The substrate region 102B may include n-type doped regions and/or p-typedoped regions for forming active devices such as transistors. The S/Dregions 104 may include heavily doped S/D (HDD), lightly doped S/D(LDD), raised regions, strained regions, epitaxially grown regions,and/or other suitable features. The S/D regions 104 may be formed byetching and epitaxial growth, halo implantation, S/D implantation, S/Dactivation, and/or other suitable processes. In an embodiment, the S/Dregions 104 further include silicidation or germanosilicidation. Forexample, silicidation may be formed by a process that includesdepositing a metal layer, annealing the metal layer such that the metallayer is able to react with silicon to form silicide, and then removingthe non-reacted metal layer. In an embodiment, the substrate region 102Bincludes fin-like active regions for forming multi-gate FETs such asFinFETs. To further this embodiment, the S/D regions 104 and the channelregions 106 may be formed in or on the fins. The channel regions 106 aresandwiched between a pair of S/D regions 104. The channel region 106conducts currents between the respective S/D regions 104 when thesemiconductor device 100 is in use.

Each of the gate stacks 108A-G may be a multi-layer structure. Further,the gate stacks 108A-G may have the same or different structures andmaterials among them. The following description applies to any one ofthe gate stacks 108A-G. In an embodiment, the gate stacks 108A-G includean interfacial layer and a polysilicon (or poly) layer over theinterfacial layer. In some embodiments, the gate stacks 108A-G mayfurther include a gate dielectric layer and a metal gate layer disposedbetween the interfacial layer and the poly layer. In some embodiments,the gate stacks 108A-G include one or more metal layers in place of thepoly layer. In various embodiments, the interfacial layer may include adielectric material such as silicon oxide (SiO₂) or silicon oxynitride(SiON), and may be formed by chemical oxidation, thermal oxidation,atomic layer deposition (ALD), chemical vapor deposition (CVD), and/orother suitable methods. The poly layer can be formed by suitabledeposition processes such as low-pressure chemical vapor deposition(LPCVD) and plasma-enhanced CVD (PECVD). The gate dielectric layer mayinclude a high-k dielectric layer such as hafnium oxide (HfO₂),zirconium oxide (ZrO₂), lanthanum oxide (La₂O₃), titanium oxide (TiO₂),yttrium oxide (Y₂O₃), strontium titanate (SrTiO₃), other suitablemetal-oxides, or combinations thereof; and may be formed by ALD and/orother suitable methods. The metal gate layer may include a p-type workfunction metal layer or an n-type work function metal layer. The p-typework function metal layer comprises a metal selected from, but notlimited to, the group of titanium nitride (TiN), tantalum nitride (TaN),ruthenium (Ru), molybdenum (Mo), tungsten (W), platinum (Pt), orcombinations thereof. The n-type work function metal layer comprises ametal selected from, but not limited to, the group of titanium (Ti),aluminum (Al), tantalum carbide (TaC), tantalum carbide nitride (TaCN),tantalum silicon nitride (TaSiN), or combinations thereof. The p-type orn-type work function metal layer may include a plurality of layers andmay be deposited by CVD, PVD, and/or other suitable process. The one ormore metal layers may include aluminum (Al), tungsten (W), cobalt (Co),copper (Cu), and/or other suitable materials, and may be formed by CVD,PVD, plating, and/or other suitable processes. The gate stacks 108A-Gmay be formed in a gate-first process or a gate-last process (i.e., areplacement gate process).

The dielectric layer 110 is disposed over the gate stacks 108A-G. In anembodiment, the dielectric layer 110 includes a metal oxide, a metalnitride, or other suitable dielectric materials. For example, the metaloxide may be titanium oxide (TiO₂), aluminum oxide (Al₂O₃), or othermetal oxides. For example, the metal nitride may be titanium nitride(TiN), aluminum nitride (AlN), aluminum oxynitride (AlON), tantalumnitride (TaN), or other metal nitrides. The dielectric layer 110 may beformed over the gate stacks 108A-G by one or more deposition and etchingprocesses.

The gate spacer 112 may be a single layer or multi-layer structure. Inan embodiment, the gate spacer 112 includes a low-k (e.g., k<7)dielectric material. In some embodiments, the gate spacer 112 includes adielectric material, such as silicon oxide (SiO₂), silicon nitride(SiN), silicon oxynitride (SiON), other dielectric material, orcombination thereof. In an example, the gate spacer 112 is formed byblanket depositing a first dielectric layer (e.g., a SiO₂ layer having auniform thickness) as a liner layer over the device 100 and a seconddielectric layer (e.g., a SiN layer) as a main D-shaped spacer over thefirst dielectric layer, and then, anisotropically etching to removeportions of the dielectric layers to form the gate spacer 112. In thepresent embodiment, the gate spacer 112 is disposed on sidewalls of thegate stacks 108A-G and on sidewalls of the dielectric layer 110.

The CES layer 114 may include a dielectric material such as siliconnitride (SiN), silicon oxide (SiO₂), silicon oxynitride (SiON), and/orother materials. The CES layer 114 may be formed by PECVD process and/orother suitable deposition or oxidation processes. The ILD layer 116 mayinclude materials such as tetraethylorthosilicate (TEOS) oxide, un-dopedsilicate glass, or doped silicon oxide such as borophosphosilicate glass(BPSG), fused silica glass (FSG), phosphosilicate glass (PSG), borondoped silicon glass (BSG), and/or other suitable dielectric materials.The ILD layer 116 may be deposited by a PECVD process, a flowable CVD(FCVD) process, or other suitable deposition technique. In anembodiment, the CES layer 114 is deposited as a blanket layer over thesubstrate 102 covering various structures thereon, and the ILD layer 116is deposited over the CES layer 114. Subsequently, portions of the ILDlayer 116 and the CES layer 114 are etched back to form trenches fordepositing the contacts 118A-B. Over the substrate region 102A, portionsof the ILD layer 116 are etched (e.g., between the gate stacks 108A and108B) until the CES layer 114 is exposed. As a result, portions of theCES layer 114 remain over the substrate region 102A between adjacentgate spacers 112. Over the substrate region 102B, portions of the ILDlayer 116 and the CES layer 114 are etched (e.g., between the gatestacks 108E and 108F) to expose the S/D regions 104 underneath.

The contacts 118A-B are separated by the structures including therespective gate stacks 108A-G, the gate spacer 112, and the CES layer114. In an embodiment, the contacts 118A-B include a metal such asaluminum (Al), tungsten (W), copper (Cu), cobalt (Co), combinationsthereof, or other suitable conductive material. In an embodiment, thecontact metal is deposited using a suitable process, such as CVD, PVD,plating, and/or other suitable processes. After the contact metal isdeposited, it may be etched back to leave room for depositing thedielectric layer 120.

The dielectric layer 120 may include a metal oxide (e.g., TiO₂ andAl₂O₃), a metal nitride (e.g., TiN, AlN, AlON, and TaN), or othersuitable dielectric materials. In various embodiments, the dielectriclayers 110 and 120 may be of the same or different materials. Thedielectric layer 120 may be deposited using PVD, CVD, or otherdeposition methods. In an embodiment, after the dielectric layer 120 isdeposited, a CMP process is performed to planarize a top surface thedevice 100. As a result, top surfaces of the various layers, 110, 112,114, 116, and 120, become co-planar.

At operation 14, the method 10 (FIG. 1A) partially recesses thedielectric layer 110. Referring to FIG. 2B, the dielectric layer 110over each of the gate stacks 108A-G is recessed. In an embodiment, theoperation 14 includes an etching process that is tuned to etch thedielectric layer 110 while the other layers, 112, 114, 116, and 120,remain substantially unchanged in the etching process. In embodiments,the operation 14 may use a dry etching, a wet etching, or other suitableetching processes. For example, a dry etching process may implement anoxygen-containing gas, a fluorine-containing gas (e.g., CF₄, SF₆, CH₂F₂,CHF₃, and/or C₂F₆), a chlorine-containing gas (e.g., Cl₂, CHCl₃, CCl₄,and/or BCl₃), a bromine-containing gas (e.g., HBr and/or CHBR₃), aniodine-containing gas, other suitable gases and/or plasmas, and/orcombinations thereof. For example, a wet etching process may compriseetching in diluted hydrofluoric acid (DHF); potassium hydroxide (KOH)solution; ammonia; a solution containing hydrofluoric acid (HF), nitricacid (HNO₃), and/or acetic acid (CH₃COOH); or other suitable wetetchant.

In an embodiment, there are different gate pitches (or gate densities)in different areas (or portions) of the device 100. Some examples areillustrated in FIG. 3 as a top view of two areas 302 and 304 of thedevice 100. Referring to FIG. 3, the area 302 includes gate stacks 306having a gate pitch P1 and the area 304 includes gate stacks 308 havinga gate pitch P2 that is greater than P1. The gate pitches P1 and P2 maybe given as center-line to center-line pitches (as shown) or edge toedge pitches. As illustrated, the area 302 has a smaller gate pitch,hence a higher gate density, than the area 304. In embodiments, thesubstrate regions 102A and 102B may correspond to areas of the device100 that have the same or different gate pitches. For example, thesubstrate region 102A may correspond to a higher gate pitch area and thesubstrate region 102B may correspond to a lower gate pitch area, or viceversa. When the dielectric layer 110 is partially etched (FIG. 2B),which is usually controlled by a timer, the different gate pitches indifferent areas of the device 100 create different etch loadings. As aresult, the dielectric layer 110 is etched more (or deeper) in someareas and less (or shallower) in some other areas. In the presentembodiment, another dielectric layer will be formed over the recesseddielectric layer 110, as will be discussed below. Therefore, thedifferent thicknesses of the recessed dielectric layer 110 will notcause issues for subsequent manufacturing processes. In the presentembodiment, the operation 14 may reduce a thickness of the dielectriclayer 110 by about 10% to about 90%, which provides a broad processwindow.

At operation 16, the method 10 (FIG. 1A) forms a dielectric layer 122over the recessed dielectric layer 110. Referring to FIG. 2C, thedielectric layer 122 is disposed over the recessed dielectric layer 110over each of the gate stacks 108A-G. In an embodiment, the operation 16includes depositing a dielectric material over the device 100 andfilling in the trenches, followed by a CMP process to remove excessivedielectric materials. Due to the different thicknesses of the recesseddielectric layer 110 as discussed above, the dielectric layer 122 mayhave different thicknesses over different gate stacks. For example, thedielectric layer 122 over the gate stacks 108A and 108D may be ofdifferent thicknesses. The dielectric layer 122 may include a metaloxide, a metal nitride, or other suitable dielectric materials. Forexample, the metal oxide may be TiO₂, Al₂O₃, or other metal oxides. Forexample, the metal nitride may be TiN, AlN, AlON, TaN, or other metalnitrides. In various embodiments, the dielectric layer 122 includes amaterial different from that of the dielectric layer 110. The dielectriclayer 122 may be formed by ALD, PVD, CVD, spin-on coating, or othersuitable deposition methods.

At operation 18, the method 10 (FIG. 1A) forms another CES layer 124over the various layers 112, 114, 116, 120, and 122. At operation 20,the method 10 (FIG. 1A) forms another ILD layer 126 (also referred to asa patterning layer 126) over the CES layer 124. Referring to FIG. 2D,the CES layer 124 may include a dielectric material such as SiN, SiO₂,and SiON. The ILD layer 126 may include an oxide such as TEOS, BPSG,FSG, PSG, and BSG. The ILD layer 126 and the CES layer 124 may includethe same materials as the ILD layer 116 and the CES layer 114respectively, or include different materials. Furthermore, in thepresent embodiment, the CES layer 124 may include the same material asthe dielectric layer 110 and/or the dielectric layer 120. The CES layer124 may be formed by a PECVD process or other suitable deposition oroxidation processes. The ILD layer 126 may be deposited by a PECVDprocess, a FCVD process, or other suitable deposition processes.

At operation 22, the method 10 (FIG. 1A) etches the ILD layer 126 toform gate via holes 128 over some of the gate stacks 108A-G. Referringto FIG. 2E, gate via holes 128 are formed in the ILD layer 126 over thegate stacks 108B, 108E, 108F, and 108G, but not over the gate stacks108A and 108C in this cross-sectional view. In an embodiment, operation22 includes a photolithography process and an etching process. Thephotolithography process may include forming a photoresist (or resist)over the ILD layer 126, exposing the resist to a pattern that definesvarious geometrical shapes for the gate via holes 128, performingpost-exposure bake processes, and developing the resist to form amasking element including the resist. The masking element, or aderivative thereof, is then used for etching recesses into the ILD layer126. The masking element (e.g., a patterned resist) is subsequentlyremoved. The etching processes may include one or more dry etchingprocesses, wet etching processes, and other suitable etching techniques.The CES layer 124 has sufficient etch selectivity with respect to theILD layer 126, and serves as an etch stop in the etching process.

Similar to the scenario with different gate pitches discussed above,there may be different gate via pitches in different areas of the device100. Some examples are illustrated in FIG. 4 as a top view of four areas402, 404, 406, and 408 of the device 100. Referring to FIG. 4, the area402 has a gate via pitch P3, the area 404 has a gate via pitch P4 thatis greater than P3, the area 406 has a gate via pitch P5 that is greaterthan P4, and the area 408 has a gate via pitch (not labeled) that isgreater than P5. In embodiments, the substrate regions 102A and 102B mayeach correspond to a dense via area (having a smaller gate via pitch) oran isolated via area (having a greater gate via pitch). However, sincethe ILD layer 126 is fully etched in the operation 22 and the two layers126 and 124 have sufficient etch selectivity, the difference in gate viapitches does not create much difference in the structure so formed.

At operation 24, the method 10 (FIG. 1B) etches the CES layer 124 andthe dielectric layer 122 through the gate via holes 128, therebyexposing a portion of the recessed dielectric layer 110 over therespective gate stacks 108B, 108E, 108F, and 108G (FIG. 2F). The etchingprocesses may include one or more dry etching processes, wet etchingprocesses, and other suitable etching techniques. In the presentembodiment, the operation 24 includes a selective etching process, i.e.,an etching process that is tuned to remove the dielectric layer 122while the dielectric layer 110 remains substantially unchanged in theetching process. As a result, the operation 24 successfully exposes andstops at the recessed dielectric layer 110 over the respective gatestacks, despite that the dielectric layer 122 may be of differentthicknesses over the respective gate stacks and/or there may bedifferent via pitches over the substrate regions 102A and 102B.

At operation 26, the method 10 (FIG. 1B) etches the ILD layer 126 oversome of the S/D contacts 118B to form S/D via holes 130 in the ILD layer126 (FIG. 2G). In an embodiment, the operation 26 includes aphotolithography process and an etching process. For example, thephotolithography process forms a masking element (e.g., a patternedresist) over the device 100, which defines the S/D via holes 130; andthe etching process etches the ILD layer 126 with the masking element asan etch mask. The etching processes may include one or more dry etchingprocesses, wet etching processes, and other suitable etching techniques.The CES layer 124 has sufficient etch selectivity with respect to theILD layer 126, and serves as an etch stop in the etching process. Themasking element is subsequently removed.

At operation 28, the method 10 (FIG. 1B) etches the ILD layer 126 overthe substrate region 102A. Referring to FIG. 2H, in the presentembodiment, the operation 28 includes a photolithography process and anetching process. The photolithography process forms a masking element(e.g., a patterned resist) over the device 100, defining trenches forforming power rails over the first substrate region 102A. The etchingprocess etches the ILD layer 126 through the masking element. Theetching process may include one or more dry etching processes, wetetching processes, and other suitable etching techniques. The etchingprocess is tuned to remove the ILD layer 126 while the CES layer 124 andthe recessed dielectric layer 110 remain substantially unchanged. Themasking element is subsequently removed.

At operation 30, the method 10 (FIG. 1B) etches the CES layer 124 andthe dielectric layer 120 over the device 100. Referring to FIG. 2I, overthe substrate region 102A, the CES layer 124 and the dielectric layer120 (see FIG. 2H) are etched. The recessed dielectric layer 110 and thedielectric layer 122 protect the gate stacks 108A-C from the etchingprocess. As a result, the power contacts 118A and the ILD layer 116 areexposed. Still referring to FIG. 2I, over the substrate region 102B, theCES layer 124 and the dielectric layer 120 are etched through the S/Dvia holes 130, thereby exposing the S/D contacts 118B thereunder. TheILD layer 126 and the recessed dielectric layer 110 protect otherstructures, including the gate stacks 108D-G, from the etching process.The etching process may include one or more dry etching processes, wetetching processes, and other suitable etching techniques.

At operation 32, the method 10 (FIG. 1B) etches the portions of therecessed dielectric layer 110 that are exposed in the gate vias 128. Theetching process may include one or more dry etching processes, wetetching processes, and other suitable etching techniques. In the presentembodiment, the etching process is tuned to remove the recesseddielectric layer 110 while the dielectric layer 122 remainssubstantially unchanged. Furthermore, other layers of material,including the gate spacer 112, the CES layers 114 and 124, the ILDlayers 116 and 126, and the contacts 118A and 118B, remain substantiallyunchanged in the etching process in the present embodiment. Referring toFIG. 2J, top surfaces of the gate stacks 108A, 108E, 108F, and 108G areexposed as a result of the etching process, while the gate stacks 108Aand 108C are still covered by a stack of the dielectric layer 122 overthe recessed dielectric layer 110. In the present embodiment, thedielectric layer 122 serves as a protection layer for the recesseddielectric layer 110. Without the dielectric layer 122, the recesseddielectric layer 110 over the gate stacks 108A and 108C would also beetched in the operation 32. In some cases, the depth of etching isdifficult to control in view of different via pitches in different areasof the device 100. Consequently, the gate stacks 108A and 108C might beinadvertently exposed, causing leakage concerns or device defects. Inthe present embodiment, the dielectric layers 110 and 122 havesufficient etch selectivity such that the recessed dielectric layer 110over the gate stacks 108B, 108E, 108F, and 108G are fully etched whilethe gate stacks 108A and 108C remain protected by the dielectric layer122 over the recessed dielectric layer 110.

At operation 34, the method 10 (FIG. 1B) deposits a metal layer 132 overthe device 100, filling in the various trenches and via holes thereon.Referring to FIG. 2K, the metal layer 132 is in electrical communicationwith: the gate stacks 108A, 108E, 108F, and 108G; the power contacts118A (between the gate stacks 108A and 108B and between the gate stacks108C and 108D); and the S/D contacts 118B (between the gate stacks 108Eand 108F and between the gate stacks 108F and 108G). The metal layer 132is electrically isolated from the gate stacks 108A, 108C, and 108D by atleast the recessed dielectric layer 110 and the dielectric layer 122. Inthe present embodiment, the metal layer 132 may include aluminum (Al),tungsten (W), cobalt (Co), copper (Cu), and/or other suitable materials,and may be formed by CVD, PVD, plating, and/or other suitable processes.

At operation 36, the method 10 (FIG. 1B) recesses the metal layer 132.Referring to FIG. 2L, in the present embodiment, the operation 36 alsorecesses the ILD layer 126 over the substrate region 102B. In anembodiment, the operation 36 includes a CMP process that removes themetal layer 132 and the ILD layer 126 until the CES layer 124 is exposedover the substrate region 102B. As a result, various metal features areformed in the device 100. Over the substrate region 102A, a power rail134 is formed, which includes a portion of the metal layer 132 and thepower contacts 118A. The power rail 134 is in electrical communicationwith the gate stack 108B, but is electrically isolated from the gatestacks 108A and 108C by at least the dielectric layer 122 and therecessed dielectric layer 110. Over the substrate region 102B, gate vias(or gate plugs) 136 are formed and are electrically connected to thegate stacks 108E, 108F, and 108G; and S/D vias (or S/D plugs) 138 areformed and are electrically connected to the S/D regions 104 through theS/D contacts 118B.

At operation 38, the method 10 (FIG. 1B) proceeds to further steps tocomplete the fabrication of the device 100. For example, the method 10may form multi-layer interconnect structure that connects the gate vias136 and the S/D vias 138 with other parts of the device 100 to form acomplete IC.

Although not intended to be limiting, one or more embodiments of thepresent disclosure provide many benefits to a semiconductor device and aformation process thereof. For example, when forming gate and S/D viasin an MEOL process, embodiments of the present disclosure can reliablyconnect some, but not all, gate stacks to a power rail, despite ofdifferent via pitches (or via densities) in different areas of thesemiconductor device. Those gate stacks that are not intended to beconnected to the power rail are fully protected by at least twodielectric layers. This prevents power punch-through issues as well asgate and contact leakage issues. The provided subject matter can beeasily integrated into existing IC fabrication flow.

In one exemplary aspect, the present disclosure is directed to a methodof forming a semiconductor device. The method includes providing aprecursor that includes a substrate having first and second regions,wherein the first region includes an insulator and the second regionincludes source, drain, and channel regions of a transistor. Theprecursor further includes first and second gate stacks over theinsulator; a third gate stack over the channel region; and a firstdielectric layer over the first, second, and third gate stacks. Themethod further includes partially recessing the first dielectric layer,forming a second dielectric layer over the recessed first dielectriclayer, and forming a contact etch stop (CES) layer over the seconddielectric layer. In an embodiment, the method further includes formingan inter-layer dielectric (ILD) layer over the CES layer, etching firstand second holes in the ILD layer over the second and third gate stacksrespectively, etching the CES layer and the second dielectric layerthrough the first and second holes to expose the recessed firstdielectric layer over the second and third gate stacks, etching the ILDlayer in the first region to expose the CES layer, and etching the CESlayer in the first region to expose the second dielectric layer. Themethod further includes etching the recessed first dielectric layer toexpose the second and third gate stacks, while the first gate stackremains covered by the recessed first dielectric layer and the seconddielectric layer over the recessed first dielectric layer.

In another exemplary aspect, the present disclosure is directed to amethod of forming a semiconductor device. The method includes providinga precursor that includes a substrate having a first region, first andsecond gate stacks over the first region, and a first dielectric layerover the first and second gate stacks. The method further includespartially recessing the first dielectric layer, forming a seconddielectric layer over the recessed first dielectric layer, forming apatterning layer over the second dielectric layer, etching a hole in thepatterning layer over the second gate stack, etching a first portion ofthe second dielectric layer through the hole to expose a first portionof the recessed first dielectric layer, and removing the patterninglayer over the first region. The method further includes etching thefirst portion of the recessed first dielectric layer to expose thesecond gate stack, while the first gate stack remains covered by asecond portion of the recessed first dielectric layer and a secondportion of the second dielectric layer.

In yet another exemplary aspect, the present disclosure is directed to asemiconductor device. The semiconductor device includes a substratehaving first and second regions, wherein the first region includes aninsulator and the second region includes source, drain, and channelregions of a transistor. The semiconductor device further includes firstand second gate stacks over the insulator, a third gate stack over thechannel region. The semiconductor device further includes a firstdielectric layer over the first, second, and third gate stacks; and asecond dielectric layer over the first dielectric layer. Thesemiconductor device further includes a metal layer over the first andsecond gate stacks, wherein the metal layer is in electricalcommunication with the second gate stack and is isolated from the firstgate stack by at least the first and second dielectric layers.

The foregoing outlines features of several embodiments so that those ofordinary skill in the art may better understand the aspects of thepresent disclosure. Those of ordinary skill in the art should appreciatethat they may readily use the present disclosure as a basis fordesigning or modifying other processes and structures for carrying outthe same purposes and/or achieving the same advantages of theembodiments introduced herein. Those of ordinary skill in the art shouldalso realize that such equivalent constructions do not depart from thespirit and scope of the present disclosure, and that they may makevarious changes, substitutions, and alterations herein without departingfrom the spirit and scope of the present disclosure.

What is claimed is:
 1. A semiconductor device, comprising: a firstconductive structure directly over an isolation structure; a secondconductive structure directly over an active region; a first dielectriclayer over the first and second conductive structures; a seconddielectric layer over the first dielectric layer, wherein the first andsecond dielectric layers include different materials; a first conductivefeature contacting the first conductive structure through at least thefirst and second dielectric layers; and a second conductive featurecontacting the second conductive structure through at least the firstand second dielectric layers, wherein the first and second conductivefeatures include a same metal.
 2. The semiconductor device of claim 1,further comprising: a third conductive structure over the isolationstructure, wherein the first conductive feature and the first and seconddielectric layers are also disposed over the third conductive structure,and the first conductive feature is insulated from the third conductivestructure by at least the first and second dielectric layers.
 3. Thesemiconductor device of claim 1, further comprising: spacer features onside surfaces of the second conductive structure and on side surfaces ofthe first and second dielectric layers over the second conductivestructure.
 4. The semiconductor device of claim 1, further comprising: athird dielectric layer over the second dielectric layer, wherein thefirst and second conductive features and the third dielectric layer aresubstantially co-planar.
 5. The semiconductor device of claim 1, furthercomprising: a source/drain feature adjacent the second conductivestructure; and a third conductive feature contacting the source/drainfeature, wherein the first and third conductive features include a samemetal.
 6. The semiconductor device of claim 5, wherein the first,second, and third conductive features are substantially co-planar. 7.The semiconductor device of claim 1, wherein a thickness of the firstdielectric layer over the first conductive structure is different fromanother thickness of the first dielectric layer over the secondconductive structure.
 8. A semiconductor device, comprising: first andsecond conductive structures directly over an isolation structure; afirst dielectric layer over the first and second conductive structures;a second dielectric layer over the first dielectric layer; and a metallayer over the first and second conductive structures, wherein the metallayer electrically contacts the second conductive structure through atleast the first and second dielectric layers and is isolated from thefirst conductive structure by at least the first and second dielectriclayers.
 9. The semiconductor device of claim 8, further comprising: aspacer feature on side surfaces of the first and second conductivestructures.
 10. The semiconductor device of claim 8, further comprising:a gate stack over an active region, wherein the first and seconddielectric layers are also over the gate stack.
 11. The semiconductordevice of claim 10, wherein the metal layer electrically contacts thegate stack through at least the first and second dielectric layers. 12.The semiconductor device of claim 10, wherein a thickness of the firstdielectric layer over the gate stack is different from another thicknessof the first dielectric layer over the first conductive structure. 13.The semiconductor device of claim 10, further comprising: a thirddielectric layer over the second dielectric layer over the gate stack,wherein the third dielectric layer and the metal layer are substantiallyco-planar.
 14. The semiconductor device of claim 8, wherein the metallayer is also disposed laterally between the first and second conductivestructures.
 15. A method of forming a semiconductor device, the methodcomprising: providing a structure that includes a first conductivestructure over an insulator, a second conductive structure over anactive region, and a first dielectric layer over the first and secondconductive structures; etching the first dielectric layer, resulting inan etched first dielectric layer covering the first and secondconductive structures; and forming a second dielectric layer over theetched first dielectric layer.
 16. The method of claim 15, furthercomprising: depositing a third dielectric layer over the seconddielectric layer; and etching a hole through the third and seconddielectric layers to expose the etched first dielectric layer over thesecond conductive structure.
 17. The method of claim 16, furthercomprising: etching the third dielectric layer to expose the seconddielectric layer over the first conductive structure.
 18. The method ofclaim 17, further comprising: extending the hole through the etchedfirst dielectric layer to expose the second conductive structure. 19.The method of claim 18, wherein the second and first dielectric layersremain over the first conductive structure during the extending of thehole through the etched first dielectric layer.
 20. The method of claim18, further comprising: depositing a conductive feature in the hole andelectrically contacting the second conductive structure.